Hybrid Additives-Subtractive Manufacturing of Multi-Layer PCBs Using Laser Direct Structuring (LDS) and Inkjet printing

Ankit Bharatbhai Goti

doi:10.18535/ijsrm/v13i06.ec04

Abstract

The increasing demand for miniaturized, high-performance, and lightweight electronic systems—particularly in applications such as wearable technology, automotive sensors, and medical implants—has driven a paradigm shift in printed circuit board (PCB) manufacturing. Traditional subtractive manufacturing methods, though reliable, pose limitations in terms of design flexibility, environmental sustainability, and scalability for complex three-dimensional structures. In response to these challenges, hybrid manufacturing processes that combine additive and subtractive techniques have emerged as a transformative solution.

This article explores a novel hybrid approach integrating Laser Direct Structuring (LDS) with Inkjet Printing to fabricate multi-layer PCBs with enhanced structural and electrical performance. LDS enables high-resolution patterning on 3D substrates by selectively activating surfaces for electroless metal deposition, offering precise subtractive control. Complementarily, inkjet printing introduces additive capabilities, enabling the selective deposition of functional inks for fine features, layer stacking, and cost-effective customization.

The study presents a comprehensive analysis of the process flow, materials compatibility, and parameter optimization needed to harmonize these two technologies. Furthermore, we discuss the implications for high-density interconnects (HDIs), thermal management, and circuit complexity in multi-layer architectures. The hybrid LDS–inkjet platform demonstrates not only the potential to improve design agility and production efficiency but also marks a significant step toward more sustainable and digitally-driven electronics manufacturing. Future outlooks suggest integration with AI-based design automation and nanomaterial-enhanced inks to further extend the capabilities of this hybrid paradigm.

Keywords

Hybrid ManufacturingAdditive-Subtractive ProcessesLaser Direct Structuring (LDS)Inkjet

References

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Park, S. H. K., Vosgueritchian, M., & Bao, Z. (2013). A review of fabrication and applications of carbon nanotube film-based flexible electronics. Nanoscale, 5(5), 1727–1752.Google Scholar ↗
Chung, J. W., & Ko, S. H. (2018). Laser-induced direct metallization for high-resolution 3D-structured electronics. ACS Applied Materials & Interfaces, 10(34), 28752–28763.Google Scholar ↗
Rathmell, A. R., & Wiley, B. J. (2011). The synthesis and coating of long, thin copper nanowires to make flexible, transparent conducting films on plastic substrates. Advanced Materials, 23(41), 4798–4803.Google Scholar ↗
Seifert, T., Hermerschmidt, F., Schäfer, N., & Goll, D. (2015). Additive manufacturing technologies for electrical machines and power electronics. Journal of Physics: Conference Series, 660, 012053.Google Scholar ↗

[refR-1] Beneventi, D., Graziano, A., Furia, G., Charpin, L., & Maurin, R. (2023). Optimization of trajectory processing algorithms to print 3D circuit boards using piezo ink jet and 6-axis robots. Journal of Manufacturing Processes, 86, 460–472.Google Scholar ↗

[refR-2] Buga, C. S., & Viana, J. C. (2021). A review on materials and technologies for organic large-area electronics. Advanced Materials Technologies, 6(8), 2100150.Google Scholar ↗

[refR-3] Kim, D., Moon, J., Kang, S., & Ko, S. H. (2022). Inkjet-printed electronics: Materials, processes, and devices. Journal of Materials Chemistry C, 10(3), 542–567.Google Scholar ↗

[refR-4] Kamyshny, A., & Magdassi, S. (2019). Conductive nanomaterials for printed electronics. Small, 15(1), 1803932.Google Scholar ↗

[refR-5] Wünscher, S., Abbel, R., Perelaer, J., & Schubert, U. S. (2014). Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices. Journal of Materials Chemistry C, 2(48), 10232–10261.Google Scholar ↗

[refR-6] Zhou, Y., Hu, Y., Liu, J., & Chen, Y. (2020). Direct laser writing for flexible electronics: Principles, materials, and applications. Advanced Functional Materials, 30(5), 1904146.Google Scholar ↗

[refR-7] Singh, M., Haverinen, H. M., Dhagat, P., & Jabbour, G. E. (2010). Inkjet printing—process and its applications. Advanced Materials, 22(6), 673–685.Google Scholar ↗

[refR-8] Ko, S. H., Pan, H., Grigoropoulos, C. P., Luscombe, C. K., Fréchet, J. M. J., & Poulikakos, D. (2007). All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 18(34), 345202.Google Scholar ↗

[refR-9] Perelaer, J., Smith, P. J., Mager, D., Soltman, D., Volkman, S. K., Subramanian, V., Schubert, U. S. (2010). Printed electronics: The challenges involved in printing devices, interconnects, and contacts based on inorganic materials. Journal of Materials Chemistry, 20(39), 8446–8453.Google Scholar ↗

[refR-10] Park, S. H. K., Vosgueritchian, M., & Bao, Z. (2013). A review of fabrication and applications of carbon nanotube film-based flexible electronics. Nanoscale, 5(5), 1727–1752.Google Scholar ↗

[refR-11] Chung, J. W., & Ko, S. H. (2018). Laser-induced direct metallization for high-resolution 3D-structured electronics. ACS Applied Materials & Interfaces, 10(34), 28752–28763.Google Scholar ↗

[refR-12] Rathmell, A. R., & Wiley, B. J. (2011). The synthesis and coating of long, thin copper nanowires to make flexible, transparent conducting films on plastic substrates. Advanced Materials, 23(41), 4798–4803.Google Scholar ↗

[refR-13] Seifert, T., Hermerschmidt, F., Schäfer, N., & Goll, D. (2015). Additive manufacturing technologies for electrical machines and power electronics. Journal of Physics: Conference Series, 660, 012053.Google Scholar ↗